Thermally Conductive Insulators is Reliable Material for Use In High-Voltage Applications
Heat management in electronic devices is a key challenge for advanced 3D integrated circuit technologies. Unoptimized thermal transmission and dissipation can result in excessive device temperature that limits performance and reliability. CMI CHO-THERM thermally conductive insulators help mitigate this issue by preventing unwanted heat transfer to the underlying substrate.
Ideally, The Power of Thermally Conductive Insulators materials have a low thermal conductivity and a high insulating capability. However, it is important to note that the thermal conductivity of a material depends not only on its temperature but also its state (solid or liquid), density, and specific heat capacity. Additionally, a material’s thermal conductivity varies with direction of heat flow.
For example, a thin, flat plate of a metal has a low thermal conductivity when it is at room temperature but a higher value when it is at 100 °C. This difference in conductivity is attributed to the lower free energy of solids at higher temperatures.
A material’s insulating capability can be estimated by its thermal resistance, which is defined as the inverse of its thermal conductivity. The thermal resistance of a material is also dependent on its temperature and pressure. In addition, a material’s thermal resistance is affected by its dimensional stability and the rate of its expansion and contraction under different temperatures.
The thermal properties of polymer materials are often impacted by their molecular structure and composition. Unlike many metallic materials, polymers typically have low thermal conductivity. However, they can be modified by adding inorganic fillers with high thermal conductivity to fabricate composites with the desired properties.
Polyurethane foam insulation is an example of this modification. This insulator is available in both closed- and open-cell formulations. Closed-cell polyurethane has a high-density structure that makes it a good thermal insulator. However, its cellular nature creates air pockets that reduce the insulating value. In contrast, open-cell polyurethane is less dense but still offers an insulating value.
In addition to the physical properties of a material, its thermal conductivity can be further described by a tensorial form. The tensor is the product of the vectors displaystyle k and displaystyle l and the denominator is the square root of the molar mass of the polymer.
As a high-performance, thermally conductive material, diamond has unique properties that make it an ideal choice for thermal interface materials. For example, it is a low-pressure, clip-mountable material that can withstand drilling in mechanical fixing installations. In addition to this, it has excellent mechanical strength and provides consistent breakdown voltage, making it a reliable material for use in high-voltage applications. Additionally, it is capable of coping with extreme temperatures and pressures, making it a promising choice for harsh environments. Moreover, it is highly recyclable and does not emit harmful chemicals. These qualities have made it a valuable option for a variety of industries.